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G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding Revision:SEMI G73-0519 (Reapproved 0526) - Current エッチング装置(ドライ&ウエット)

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Description

エッチング装置(ドライ&ウエット)

• Equipment and load port access mode switching

SEMI E37-0702 (technical revision)

This Standard specifies measuring methods

A similar unit without the box opening function may be compatibly designed to facilitate placement of an open cassette (e

G07300 - SEMI G73 - Test Method for Pull Strength for Wire Bonding Revision:SEMI G73-0519 (Reapproved 0526) - Current エッチング装置(ドライ&ウエット)1 Purpose 1. 1 This Standard defines the pull strength test method for wire bonding. 2 Scope 2. 1 This Standard defines the destructive pull strength test method and its criterion for evaluating pull strength of wire bonds connecting two points, connected by using ball bonding technique. 2. 2 This Standard can be applied to measure wires whose diameter is less than 100 microns. NOTICE: SEMI Standards and Safety Guidelines do not purport to address all

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